TSMC FinFlex ™, N2 Process Innovations debut at the 2022 North American Technology Symposium

SANTA CLARA, California – (BUSINESS THREAD) – TSMC (TWSE: 2330, NYSE: TSM) showcased the latest innovations in its advanced logic, specialty and 3D IC technologies at the Company’s 2022 North American Technology Symposium today, driven by the next generation of the cutting-edge N2 process. nanosheet transistors and special FinFlex Making technology debut for N3 and N3E processes.

After being networked for the past two years, personally recovering as an event, the North American Symposium in Santa Clara, California is launching a number of technology symposia around the world in the coming months. The conference also provides an Innovation Center that highlights the achievements of start-up clients at TSMC.

“We live in a rapidly changing digital world, where the demand for computing power and energy efficiency is growing faster than ever before, creating unprecedented opportunities and challenges for the semiconductor industry,” said Dr. CC Wei, CEO of TSMC. “The innovations we show at our Technology Symposium demonstrate TSMC’s technological leadership and commitment to supporting our customers during this exciting transformation and growth.”

The main technologies highlighted at the symposium are:

TSMC FinFlex For N3 and N3 – TSMC’s industry-leading N3 technology, to be introduced into volume production later in 2022, will feature the revolutionary TSMC FinFlex. architectural innovation that offers unparalleled flexibility for designers. TSMC FinFlex The innovation offers the choice of different standard cells for 3-2 wing configuration for ultra performance, 2-1 wing configuration for best power efficiency and transistor density, and 2-2 wing configuration for efficient performance. With TSMC FinFlex in architecture, customers can create system designs that are tailored to their needs, with functional blocks that implement the best optimized grain configuration for desired performance, power, and field goal, and integrated on the same chip. For more information on FinFlex, visit N3.TSMC.COM.

N2 Technology – TSMC’s N2 technology represents another significant advance over the N3, with a 10-15% improvement in speed at the same power or a 25-30% reduction in power at the same speed, ushering in a new era of efficient performance. The N2 will feature a nanosheet transistor architecture to provide an improvement in full-node performance and power efficiency to enable next-generation TSMC customer product innovations. The N2 technology platform includes a high-performance variant in addition to the basic version of mobile computing, as well as comprehensive chiplet integration solutions. N2 is scheduled to start production in 2025.

Ultra-Low Power Platform Expands – Following the success of N12e technology announced at the 2020 Technology Symposium, TSMC is developing N6e to provide the computing power and energy efficiency required by AI and IoT devices that are attuned to the next evolution of process technology. The N6e will be based on TSMC’s advanced 7nm process and is expected to have a logic density three times higher than the N12e. It will be part of TSMC’s Ultra-Low Power platform, a comprehensive portfolio of logic, RF, analog, embedded non-volatile memory and power management IC solutions for edge AI and Internet of Things applications.

TSMC 3DFabric 3D Silicon Stacking Solutions – TSMC is showcasing two innovative TSMC-SoIC client applications chip removal solution:

  1. Chip-on-Wafer (CoW) technology to stack as the world’s first SoIC-based SRAM CPU level 3 cache

  2. An innovative intelligent processing unit stacked on a deep trench condenser die using Wafer-on-Wafer (WoW) technology.

With the N7 chips for both CoW and WoW already in production, support for N5 technology is scheduled for 2023. To meet the demand of SoIC and other TSMC 3DFabric customers. system integration services, the world’s first fully automated 3DFabric plant will begin production in the second half of 2022.

About TSMC

Founded in 1987, TSMC was a pioneer in the pure gaming foundry business model, and has been a leader in the world of dedicated semiconductors ever since. The company supports a thriving global customer and partner ecosystem with industry-leading process technologies and a portfolio of design-enabled solutions to unleash innovation for the global semiconductor industry. With global operations in Asia, Europe and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 291 different process technologies and manufactured 12,302 products for 535 customers in 2021, offering the widest range of advanced, specialized and advanced packaging technology services. TSMC is the first foundry to offer 5 nanometer production capabilities, the most advanced semiconductor process technology available in the world. The company is headquartered in Hsinchu, Taiwan. For more information, visit https://www.tsmc.com.

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